WMSC008H12B1P

WeEnPACK-B1 module with WeEn 1200V Gen2 SiC MOSFET and PressFit pin type. Intergrated with NTC temperature sensor

Features and Benefits
  • Half bridge topology
  • PressFit pins technology
  • Low RDSon
  • Low Switching Losses
  • Low Qg and Crss
  • Low Inductive Design
Applications
  • Power inverters
  • AC-DC converters
  • DC-DC converters
  • Active power factor correctors
  • Motor drivers

 

Parametric
Package
Quality, reliability & chemical content
Ordering

 

Type Number Symbol Parameter Conditions Min Typ Max Unit
WMSC008H12B1P VDS  drain-source voltage       1200 V
ID  drain current  VGS = 18 V; Th = 25 °C     153 A
Tj  junction temperature   -40   150 °C
RDS(on)  drain-source on-state
 resistance
 VGS = 15 V; ID = 150 A; Tj = 25 °C   8.0  
 VGS = 18 V; ID = 150 A; Tj = 25 °C   6.5  
QG(tot)  total gate charge  ID = 150 A; VDS = 800 V; VGS = -4 V/18 V;
 T
j = 25 °C
  594   nC
QGD  gate-drain charge   116   nC
Qr  recovered charge  ISD = 150 A; VGS = -4 V; di/dt = 7500 A/μs;
 V
R = 600 V; Tj = 25 °C
  1890   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WMSC008H12B1P

WeEnPACK-B1

TRAY PACK,EPE OR BLISTER Volume production Standard Marking WMSC008H12B1P6T 9340 737 42300
Datasheet
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WMSC008H12B1P 9340 737 42300 WMSC008H12B1P6T NA NA  

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WMSC008H12B1P WMSC008H12B1P6T WMSC008H12B1P Leaded  E NA    

Chemical Content - WMSC008H12B1P

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.